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Introduction to the process and structure of film capacitors

Release time:

2024-09-27

Introduction to the process and structure of film capacitors

Film capacitors are a kind of common electronic components, which have the advantages of small size, light weight, large capacity and high reliability, and are widely used in various electronic devices. The process and structure of film capacitors have an important impact on their performance and reliability. In this paper, the process and structure of film capacitors will be introduced in detail.

First, the film capacitor process
Film capacitor manufacturing process mainly includes metal film deposition, lithography, corrosion and other steps.

Metal film deposition: metal film deposition is a key step in the preparation of film capacitors, which directly affects the performance of the capacitor. Metal film deposition methods include evaporation coating, magnetron sputtering and so on. Evaporation coating is the metal in the vacuum conditions of heating and evaporation, so that it is deposited on the substrate; magnetron sputtering is the metal target under the action of the magnetic field by the ion bombardment, so that it is deposited on the substrate. Metal film deposition process needs to control the deposition rate, temperature and other parameters to ensure the quality and performance of the metal film.

Photolithography: Photolithography is the process of transferring a metal film pattern to a substrate through photoresist. Photoresist is a light-sensitive material that undergoes a chemical reaction to form a resist layer when exposed to UV light. The photolithography process includes steps such as coating, exposure, and development. Gluing is to evenly coat the photoresist on the substrate; exposure is to irradiate the photoresist with UV light through a mask, causing it to undergo a chemical reaction; and developing is to dissolve the unreacted photoresist, leaving the desired metal film pattern. The photolithography process needs to control the exposure time, developer concentration and other parameters to ensure the accuracy and quality of the metal film pattern.

Erosion: Erosion is the unwanted part of the removal, leaving the desired metal film pattern process. Corrosion methods include wet corrosion, dry corrosion and so on. Wet corrosion is the substrate immersed in the corrosion solution, through the chemical reaction will be unwanted part of the removal; dry corrosion is under vacuum conditions, through the ion bombardment will be unwanted part of the removal. The corrosion process needs to control the composition, concentration, corrosion time and other parameters of the corrosion solution to ensure the shape and size of the metal film pattern.

Second, the structure of film capacitors

Film capacitors are made by winding two pieces of plastic film with metal electrodes into a cylindrical shape, and finally encapsulated into a mold; because the medium is usually plastic material, also known as plastic film capacitors.

In summary, the process and structure of film capacitors have a significant impact on their performance and reliability. Understanding these principles helps us to better understand and apply film capacitors.